• ICMMM 2024
  • June 14-16, 2024 丨 Warsaw, Poland

ICMMM aims to provide a platform for scholars, engineers, and scientists to present robust research demonstrating the expanding frontiers in the fields of Mechanical, Materials and Manufacturing. The past seven events were held in Chengdu (China, 2014), Paris (France, 2015), Savannah (USA, 2016), Atlanta (USA, 2017), Orlando (USA, 2018), Boston (USA, 2019), Virtual Conference (2020, 2021, 2022), Washington, D. C.(USA, 2023) successively. Special gratitude would be extended to all keynotes speakers and TPC members for their technical advices, and to all the scholars and experts in this field for eager supports. For the 9th conference in Warsaw, the Organizing Committees expects and firmly believes that attendees from all over the world would be harvested academically and enjoy Poland customs and practices.

On behalf of the Organizing Committees of 2024 11th International Conference on Mechanics, Materials and Manufacturing (ICMMM 2024), we cordially invite you to participate in this event to be held in Warsaw, Poland from June 14-16, 2024, supported by Warsaw University of Technology(Poland), AGH University of Science and Technology(Poland), College of Economics and Computer Science (WSEI)(Poland) and Capitol Technology University(USA).

Paper Publication

Submitted papers will be reviewed by 2-3 reviewers. Accepted and presented papers in ICMMM 2024 will be published into Conference Proceedings or Journals, as followings:
Note: After passing the TTP review, the article is assigned to the following publications according to the topic:

>>Key Engineering Materials (ISSN: 1662-9795)/Materials Science Forum (ISSN: 1662-9752), Abstracting/Indexing: Scopus, Inspec (IET), CAS, etc. (only for papers related to Material)
>>Advances in Science and Technology (ISSN: 1662-8969), Abstracted/Indexed in: Scopus, Google Scholar, ProQuest, etc.
>>Defect and Diffusion Forum (ISSN: 1012-0386), Abstracted/Indexed in: SCOPUS, Ei, Inspec (IET, Institution of Engineering Technology), etc.
>>Solid State Phenomena (ISSN: 1012-0394), Abstracted/Indexed in: SCOPUS, Inspec (IET, Institution of Engineering Technology), Google Scholar, ProQuest, etc.

Option II: International Journal of Mechanical Engineering and Robotics Research (ISSN: 2278-0149 (Online), Abstracting/Indexing: Scopus, CNKI, Google Scholar, Crossref, etc. (only for papers related to Mechanical and Manufacturing)

ICMMM 2022 accepted papers are online: https://www.scientific.net/MSF.1085 or https://www.scientific.net/KEM.944

SIVT track

Key Dates

Submission Deadline: May 10, 2024
Author Notification: May 20, 2024
Registration Deadline: May 25, 2024
Camera-Ready Paper Due: May 25, 2024

SITIS workshops  

Join as Delegates (without presentation)

The ICMMM is a global event focused on Mechanical, Materials and Manufacturing. It is a good chance and an effective platform to meet many renowned experts and researchers in the field of Mechanical, Materials and Manufacturing. Welcome you to attend the great event. Delegate's fast registration directly via the payment link. http://confsys.iconf.org/register/icmmm2024

Join as Reviewer

We sincerely welcome professors, associate professors, teachers and other experts in the areas of Mechanical, Materials and Manufacturing join the conference as a reviewer. We sincerely welcome you to send email for further information. Your request will be processed in 5 working days. Sincerely welcome you to join us.

Program Schedule

ICMMM 2024 program at a glance

  • 10:00 – 17:00

    Conference Check in and Materials CollectionOnline Pre-Test

  • 09:00 – 09:10

    Opening Remarksby Conferece Chair

  • 09:10 – 09:55

    Keynote Speech-1

  • 09:55 – 10:40

    Keynote Speech-2

  • 10:40 – 11:00

    Coffee Breaks

  • 11:00 – 11:45

    Keynote Speech-3

  • 11:45 – 12:30

    Keynote Speech-4

  • 12:30 – 13:30


  • 13:30 – 18:00


  • 09:00 – 12:00


  • 12:00 – 13:30


  • 13:30 – 18:00


Keynote Speakers in previous ICMMMs

Prof. Ramesh Agarwal

Washington University in St. Louis, USA

Fellow of IEEE, AIAA, ASME, AAAS, APS...

Prof. Dr. Osamu TABATA

Kyoto University of Advanced Science, Japan

Fellow of IEEE

Prof. Dr. Chris Yuan

Case Western Reserve University, USA

Fellow of American Society of Mechanical Engineers

Prof. Alan Lau

Swinburne University of Technology, Australia

Fellow of Institution of Engineers, Australia